Title:
撮像素子実装用基体、撮像装置および撮像モジュール
Document Type and Number:
Japanese Patent JP6732932
Kind Code:
B2
Abstract:
An image sensor mounting base includes a substrate, and a first, a second, a third and a fourth electrode pad. The substrate has an upper surface including a first mount area where a first image sensor is mountable, and a second mount area where a second image sensor is mountable. The second mount area is spaced from the first mount area. The first and second electrode pads are located on the upper surface of the substrate and across the first mount area each other. The third and fourth electrode pads on the upper surface of the substrate are spaced from the first electrode pad and the second electrode pad and face each other across the second mount area. The substrate has, on the upper surface, a recess between the third electrode pad and the fourth electrode pad. The second mount area is located on a bottom of the recess.
Inventors:
Kenichi Obama
Takeshita Writing
Takeshita Writing
Application Number:
JP2018547747A
Publication Date:
July 29, 2020
Filing Date:
October 26, 2017
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L27/146; H01L23/02; H01L23/12; H01L25/04; H01L25/18; H04N5/225; H04N5/335
Domestic Patent References:
| JP2007306282A | ||||
| JP2007150034A | ||||
| JP2016122723A | ||||
| JP2014232851A | ||||
| JP2005292242A | ||||
| JP2016092436A |
Foreign References:
| WO2013081156A1 |