Title:
化学増幅型ポジ型感光性樹脂組成物
Document Type and Number:
Japanese Patent JP6734109
Kind Code:
B2
Abstract:
A chemically amplified positive-type photosensitive resin composition capable of forming a resist pattern having a nonresist portion with a favorable rectangular sectional shape, a method of manufacturing a resist pattern using the composition, a method of manufacturing a substrate with a template using the composition, and a method of manufacturing a plated article using the substrate with a template manufactured by the method. In a chemically amplified positive-type photosensitive resin composition including an acid generator, a resin whose solubility in alkali increases under the action of acid, and an organic solvent, an acrylic resin is used that includes a constituent unit derived from an acrylic acid ester including an —SO2-containing cyclic group or a lactone-containing cyclic group, and a constituent unit derived from an acrylic acid ester containing an organic group including an aromatic group and an alcoholic hydroxyl group.
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Inventors:
Makiko Irie
Aya Momozawa
Aya Momozawa
Application Number:
JP2016091292A
Publication Date:
August 05, 2020
Filing Date:
April 28, 2016
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/039; C08F220/30; G03F7/20; G03F7/40
Domestic Patent References:
JP2015025879A | ||||
JP2010061097A | ||||
JP2010053163A | ||||
JP2015200874A | ||||
JP2015194715A |
Foreign References:
WO2014208102A1 | ||||
US20090155719 |
Attorney, Agent or Firm:
Masayuki Masabayashi