Title:
部品実装機
Document Type and Number:
Japanese Patent JP6734465
Kind Code:
B2
Abstract:
A component mounter for: performing a pitch feeding operation, in which a component supply tape (24) is fed at a prescribed pitch at a time while a cover film (30) is peeled from the upper surface of the component supply tape using a tape feeder (23), and at each completion of the pitch feeding operation; suctioning, using a suction nozzle (27), a component (26) in a component housing recess (29) which has stopped at a prescribed component suctioning position; and mounting the component (26) onto a circuit substrate (12), wherein: the component in the component housing recess which has arrived at the component suctioning position due to the pitch feeding is imaged a plurality of times from above by a camera (34); the plurality of images obtained by the imaging performed a plurality of times are processed, and the position of the component in the component housing recess is identified for each of the images; and there is performed a component stoppage stability determination for determining, on the basis of the results of processing the plurality of images, the stability state of the component in the component housing recess immediately after the completion of the pitch feeding.
Inventors:
Atsushi Iisaka
Shigeto Oyama
Shigeto Oyama
Application Number:
JP2019500157A
Publication Date:
August 05, 2020
Filing Date:
February 20, 2017
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/08; H05K13/02
Domestic Patent References:
| JP2014204058A | ||||
| JP2016157754A | ||||
| JP2014110410A |
Foreign References:
| US20030159279 |
Attorney, Agent or Firm:
Muneo Kako