Title:
基材粒子、基材粒子の製造方法、導電性粒子、導電材料及び接続構造体
Document Type and Number:
Japanese Patent JP6739988
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a base material particle capable of suppressing scratch of an adherend and favorably contacting the base material or particles using the base material to the adherend even when the adherend is warped.SOLUTION: The base material particle has compression elasticity modulus with 10% compression of 1500 N/mmor less, compression elasticity modulus with 20% compression of 1000 N/mmor less, a ratio of compression elasticity modulus with 10% compression to compression elasticity modulus with 20% compression of 1.5 or more, and no bent part exists by 50% compression in a compressive displacement-compressive load curve in a compression test.SELECTED DRAWING: Figure 1
Inventors:
Yasuyuki Yamada
Saori Ueda
Saori Ueda
Application Number:
JP2016089081A
Publication Date:
August 12, 2020
Filing Date:
April 27, 2016
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08F2/44; C08F4/04; C08F4/34; C08F220/20; C08K9/02; C08L33/04; C08L101/00; C23C18/32; C23C18/52; H01B1/00; H01B5/00; H01B5/16; H01B13/00; H01R11/01
Domestic Patent References:
| JP2011060502A | ||||
| JP2000319309A | ||||
| JP2012221952A | ||||
| JP2006291200A | ||||
| JP2004067789A | ||||
| JP4114001A | ||||
| JP2010235951A | ||||
| JP2012036335A | ||||
| JP2002033022A | ||||
| JP2000204119A | ||||
| JP7140481A | ||||
| JP2013062069A |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office