Title:
センサ基板およびセンサ装置
Document Type and Number:
Japanese Patent JP6744402
Kind Code:
B2
Abstract:
A sensor substrate includes an insulating substrate, an electrode disposed on a principal face of the insulating substrate, a resistor wiring section in a form of multiple layers located within the insulating substrate, the multiple layers being disposed in a thickness direction of the insulating substrate, and a widened metallic layer disposed so as to overlap the electrode, as seen in a transparent plan view of the sensor substrate.
Inventors:
Matsumoto Taishi
Application Number:
JP2018514671A
Publication Date:
August 19, 2020
Filing Date:
April 26, 2017
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
G01K7/18
Domestic Patent References:
| JP2171626A | ||||
| JP2016008946A | ||||
| JP2009085952A | ||||
| JP2003517574A |
Foreign References:
| WO2015163278A1 |