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Patent Searching and Data


Title:
配線回路基板およびその製造方法
Document Type and Number:
Japanese Patent JP6745712
Kind Code:
B2
Abstract:
An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0

Inventors:
Shusaku Shibata
High Honodai
Takato Hayato
Yoshihiro Kawabe
Shuichi Wakaki
Application Number:
JP2016232481A
Publication Date:
August 26, 2020
Filing Date:
November 30, 2016
Export Citation:
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Assignee:
NITTO DENKO CORPORATION
International Classes:
H05K3/18; H05K3/00
Domestic Patent References:
JP2005286207A
JP6318352A
JP271509A
JP49846A
JP7272996A
JP1167639A
JP11237744A
JP2009545774A
JP2011205042A
JP2013174728A
JP201682145A
Foreign References:
US5652645
WO2014109044A1
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda