Title:
部品供給装置および電子部品実装機
Document Type and Number:
Japanese Patent JP6746403
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a component supply device which enables downsizing of a component supply member and achieves high workability in attachment/detachment of a holding member, and to provide an electronic component mounting machine.SOLUTION: A component supply device 4 includes: a component supply base 41; multiple component supply members 40 which are disposed so as to be attached to or detached from the component supply base 41 and store electronic components; and a holding member 42 which is disposed so as to be attached to/detached from the component supply members 40 and commonly used for the component supply members 40.SELECTED DRAWING: Figure 3
Inventors:
Nguyen Hieu Gear
Application Number:
JP2016131449A
Publication Date:
August 26, 2020
Filing Date:
July 01, 2016
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/02
Domestic Patent References:
| JP11074692A | ||||
| JP2001156493A |
Attorney, Agent or Firm:
Tomoaki Higashiguchi
Shindo Motoko
Kudo snow
Shindo Motoko
Kudo snow