Title:
積層型電子部品および積層型電子部品モジュール
Document Type and Number:
Japanese Patent JP6750728
Kind Code:
B2
Abstract:
Provided is a laminated-type electronic component which is integrated with high adhesive strength, and in which crosstalk occurring between electrodes formed on upper and lower sides of a low dielectric constant insulating layer is suppressed. The laminated-type electronic component is provided with a plurality of laminated insulating layers, wherein: at least one layer of the insulating layers is a low dielectric constant insulating layer; by means of an adhesive having a higher relative permittivity than that of the low dielectric constant insulating layer, the low dielectric constant insulating layer is bonded to another low dielectric constant insulating layer which is adjacent in the laminating direction, or bonded to a high dielectric constant insulating layer having a higher relative permittivity than that of the low dielectric constant insulating layer which is adjacent in the laminating direction; and an electrode is formed between the low dielectric constant insulating layers that are bonded to each other, or between the low dielectric constant insulating layer and the high dielectric constant insulating layer that are bonded to each other.
Inventors:
Ryota Asai
Yosuke Matsushita
Yosuke Matsushita
Application Number:
JP2019509748A
Publication Date:
September 02, 2020
Filing Date:
March 25, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K1/16; H05K3/46
Domestic Patent References:
| JP2001144452A | ||||
| JP2004363425A | ||||
| JP2296882A | ||||
| JP11205012A | ||||
| JP61160953A |
Foreign References:
| US20080116558 |
Attorney, Agent or Firm:
Nao Kawamoto