Title:
金属基板および電子機器
Document Type and Number:
Japanese Patent JP6765196
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To realize improvement of bending strength and torsional strength of an electronic device and thinning.SOLUTION: A metal substrate 10 is disposed inside a casing of an electronic device (smartphone 100), and at least a part (side edge 11) of the outer edge of the metal substrate 10 is folded toward a center 1c of the casing. A frame 1 and the metal substrate 10 are integrally formed as one member, and this member is manufactured by integrally molding the metal substrate 10 and a resin material forming the frame 1 by molding.SELECTED DRAWING: Figure 1
Inventors:
Hideto Ohori
Junya Takahashi
Junya Takahashi
Application Number:
JP2016039181A
Publication Date:
October 07, 2020
Filing Date:
March 01, 2016
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H05K5/02; H04M1/02
Domestic Patent References:
| JP2011189622A | ||||
| JP49006538Y1 | ||||
| JP2009086631A | ||||
| JP2108359U | ||||
| JP4004776U | ||||
| JP7297575A | ||||
| JP2012049629A | ||||
| JP2011090096A | ||||
| JP57040988A |
Foreign References:
| WO2016017133A1 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark