Title:
構造体の製造方法
Document Type and Number:
Japanese Patent JP6765891
Kind Code:
B2
Abstract:
A method of manufacturing a structure including a substrate and a photosensitive resin layer provided on the substrate includes irradiating a region of the photosensitive resin layer with light in a state where a layer is provided on a surface of the substrate, the region being located above a space surrounded by the substrate and the photosensitive resin layer, and the surface facing the space, and removing a portion of the photosensitive resin layer located above the space to form a hole, wherein the provided layer has a reflectance of 40% or less with respect to the light.
Inventors:
Tominaga Kosuke
Tetsushi Ishikawa
Manabu Otsuka
Tetsushi Ishikawa
Manabu Otsuka
Application Number:
JP2016150410A
Publication Date:
October 07, 2020
Filing Date:
July 29, 2016
Export Citation:
Assignee:
Canon Inc
International Classes:
B41J2/16; B41J2/14
Domestic Patent References:
| JP62095528A | ||||
| JP2006227544A | ||||
| JP2014069421A | ||||
| JP2014046543A | ||||
| JP2007253472A |
Foreign References:
| US20090091604 |
Attorney, Agent or Firm:
Takuma Abe
Sogo Kuroiwa
Sogo Kuroiwa