Title:
部品実装システムおよび部品実装方法
Document Type and Number:
Japanese Patent JP6767643
Kind Code:
B2
Abstract:
To provide a component mounting system and component mounting method which can feed back positional deviation information of a component in order to improve the mounting accuracy of a component.SOLUTION: An inspection device M4 for inspecting a substrate to which a component is mounted by component mounting devices M2, M3 (mounting devices) includes: detection parts (inspection processing part 32, inspection camera 33) which detect inspection information 31c having a positional deviation amount of a component mounted on the substrate; a determination part 30a which determines whether or not the detected positional deviation amount is within a prescribed first range; a transmission part 30b which transmits the detected positional deviation amount to the mounting devices; and a determination part 30c which determines whether or not to transmit the detected positional deviation amount to the mounting devices. The determination part 30c reserves transmission of the positional deviation amount to the mounting devices when it is determined that the positional deviation amount is within the first range and a prescribed condition is satisfied.SELECTED DRAWING: Figure 5
Inventors:
Ryoji Eguchi
Toshihiko Eiji
Toshihiko Eiji
Application Number:
JP2019114419A
Publication Date:
October 14, 2020
Filing Date:
June 20, 2019
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H05K13/08; G05B19/418; H05K13/04
Domestic Patent References:
| JP2002303590A | ||||
| JP2005228949A | ||||
| JP2014216353A |
Foreign References:
| WO2014080525A1 |
Attorney, Agent or Firm:
Kenji Kamada
Koichi Nomura
Koichi Nomura