Title:
電子部品装着機
Document Type and Number:
Japanese Patent JP6768296
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component mounter capable of precisely recognizing a cavity at a component supplying position.SOLUTION: An electronic component mounter 9 includes: a tape feeder 1 feeding a carrier tape 8 to a component supplying position 15, the carrier tape being provided, at a certain interval, with a plurality of sprocket holes 832, 841 and a plurality of cavities 831 for receiving a plurality of components; a substrate camera 946 (imaging device) for imaging images at a plurality of predetermined positions in the carrier tape 8 fed by the tape feeder 1; and a component transfer device 94 correcting the component supplying position 15 on the basis of images at the plurality of predetermined positions and picking a component P received in the cavity 831 at the corrected component supplying position 15 to mount the component P on a substrate K that is positioned on a component mounting position.SELECTED DRAWING: Figure 6
Inventors:
Shinya Sugiura
Hiroki Murase
Takashi Kawatani
Hiroki Murase
Takashi Kawatani
Application Number:
JP2016003777A
Publication Date:
October 14, 2020
Filing Date:
January 12, 2016
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/02; H05K13/08
Domestic Patent References:
| JP2003168890A | ||||
| JP2010135690A | ||||
| JP2010050338A |
Foreign References:
| WO2005101944A1 |
Attorney, Agent or Firm:
Kiichi Yamamoto
Kobayashi Osamu
Kimura Gunji
Kobayashi Osamu
Kimura Gunji