Title:
真空搬送モジュール及び基板処理装置
Document Type and Number:
Japanese Patent JP6775432
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a vacuum transfer module and a substrate processing apparatus, having excellent maintainability.SOLUTION: In a vacuum transfer module 1 and a substrate processing apparatus 100, a conveying chamber 11 in which a planar view shape is convex m-angular shape (m is integer number of 4 or more); and a conveying mechanism 12 that conveys a substrate. A first side face L1, a second side face L2 and a third side face L3, which are adjacent at least in this order among the m side surfaces in the conveying chamber, can be connected to a first processing chamber P1, a second processing chamber P2 a third processing chamber P3 respectively in which the substrate is processed. Each side face is substantially orthogonal to a liner line connecting a planar view center of the conveying chamber with the connected planar view center of the first processing chamber, a liner line connecting the planar view center of the conveying chamber with the connected planar view center of the second processing chamber, and a liner line connecting the planar view center of the conveying chamber with the connected planar view center of the third processing chamber. An angle αformed by the first side face and the second side face is different from an angle αformed by the second side face and the third side face.SELECTED DRAWING: Figure 1
Inventors:
Yasuyuki Hayashi
Takeshi Mukai
Takeshi Mukai
Application Number:
JP2017010133A
Publication Date:
October 28, 2020
Filing Date:
January 24, 2017
Export Citation:
Assignee:
spp Technologies Co., Ltd.
International Classes:
H01L21/677; B65G49/07
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Attorney, Agent or Firm:
Makoto International Patent Office