Title:
ボンディングツール冷却装置およびこれを備えたボンディング装置ならびにボンディングツール冷却方法
Document Type and Number:
Japanese Patent JP6778676
Kind Code:
B2
Abstract:
Provided are a bonding tool cooling device and a bonding tool cooling method whereby a bonding tool can be cooled in a contactless and efficient manner. Specifically, there are provided a bonding tool cooling method and a bonding tool cooling device for cooling a bonding tool provided with: an attachment tool for attaching and holding a semiconductor chip component by suction; a heater for heating the attachment tool; and a suction attachment mechanism for attaching and holding the attachment tool onto the heater by suction, the bonding tool cooling device being provided with a cooling device comprising a spraying opening for spraying gas perpendicularly against an attachment tool surface.
Inventors:
Katsumi Terada
Kawamura Tomonori
Kawamura Tomonori
Application Number:
JP2017508263A
Publication Date:
November 04, 2020
Filing Date:
March 16, 2016
Export Citation:
Assignee:
Toray Engineering Co., Ltd.
International Classes:
H01L21/60
Domestic Patent References:
| JP57004129A | ||||
| JP4111329A | ||||
| JP2012015255A |
Foreign References:
| WO2012165313A1 | ||||
| WO2014157134A1 |