Title:
インピーダンス整合システム、インピーダンス整合方法および半導体処理装置
Document Type and Number:
Japanese Patent JP6780009
Kind Code:
B2
Abstract:
An impedance matching system is provided. The impedance matching system includes: an impedance matching device arranged between a radio frequency (RF) power supply and a reaction chamber, adapted to connect the RF power supply to the reaction chamber through a switch, and configured to automatically perform an impedance matching on an output impedance of the RF power supply and an input impedance of the impedance matching device; the switch and a load circuit, the switch being configured to enable the RF power supply to be selectively connected to the reaction chamber or to the load circuit; and a control unit configured to control the switch to connect the RF power supply to the reaction chamber or connect the RF power supply to the load circuit according to a preset timing sequence. The impedance matching device is configured to convert a continuous wave output of the RF power supply into a pulse output according to the preset timing sequence, and provide the pulse output to the reaction chamber. The preset timing sequence is obtained based on a frequency and a duty cycle of a pulsed RF signal required by a process.
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Inventors:
Eiji
Ningbo Yang
Lee Xing
Tsuyoshi Tsui
Ningbo Yang
Lee Xing
Tsuyoshi Tsui
Application Number:
JP2018549875A
Publication Date:
November 04, 2020
Filing Date:
May 03, 2016
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
International Classes:
H03H7/40
Domestic Patent References:
| JP62050472A | ||||
| JP2009124687A | ||||
| JP2012142285A | ||||
| JP2008042890A | ||||
| JP2013135159A | ||||
| JP9082496A | ||||
| JP2013122966A |
Attorney, Agent or Firm:
Fukami patent office