Title:
表面実装型インターポーザ及び電子機器
Document Type and Number:
Japanese Patent JP6780523
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To confirm whether a flat cable is connected with a printed wiring board of interposer, or the like, easily.SOLUTION: A surface-mount interposer 20 includes a laminate laminating multiple ceramic layers. It includes a first terminal electrode 41 for a flat cable formed on the first principal surface 201, second terminal electrodes 42, 44 for a printed wiring board formed on the second principal surface 202, and a wiring conductor provided in the laminate and connecting the first terminal electrode 41, 43 and the second terminal electrode 42. The laminate has first through holes 31, 33 and second through holes 32, 34. One end of the first through holes 31, 33 are concatenated with the first terminal electrode 41, 43, and penetrating the first terminal electrode 41, 43, while the other end is opened to the first principal surface 201 or the lateral face 203. One end of the second through holes 32, 34 are concatenated with the second terminal electrode 42, 44, and penetrating the second terminal electrode 42, 44, while the other end is opened to the first principal surface 201 or the lateral face 203.SELECTED DRAWING: Figure 1
Inventors:
矢▲崎▼ 浩和
Yonemori Keito
Yonemori Keito
Application Number:
JP2017017267A
Publication Date:
November 04, 2020
Filing Date:
February 02, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K1/14; H05K1/02
Domestic Patent References:
| JP58465U | ||||
| JP8153750A | ||||
| JP201523040A | ||||
| JP10294544A | ||||
| JP200022311A |
Foreign References:
| WO2014002757A1 |
Attorney, Agent or Firm:
Kaede International Patent Office