Title:
電子機器
Document Type and Number:
Japanese Patent JP6783349
Kind Code:
B2
Abstract:
To improve rigidity of a frame while attaining miniaturization of an electronic device.SOLUTION: An electronic device 1 includes: a frame 20 surrounding components such as a cooling fan 5, an optical disk drive 7, a power supply unit 40; and chassis 32, 33 attached to the frame 20 and covering a circuit board 31. The electronic device 1 has a metal plate 39. The metal plate 39 is disposed on a side opposite to the chassis 32, 33 with the components such as the cooling fan 5 interposed therebetween. The metal plate 39 is attached to the frame 20.SELECTED DRAWING: Figure 6
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Inventors:
Kenji Hirose
Kazuto Nakagawa
Shinya Tsuchida
Yasuhiro Otori
Kazuto Nakagawa
Shinya Tsuchida
Yasuhiro Otori
Application Number:
JP2019106441A
Publication Date:
November 11, 2020
Filing Date:
June 06, 2019
Export Citation:
Assignee:
Sony Interactive Entertainment Inc.
International Classes:
G06F1/16; G06F1/20; H05K7/20
Domestic Patent References:
| JP2012227295A | ||||
| JP2002134968A | ||||
| JP2015130053A | ||||
| JP2010171232A | ||||
| JP9044269A |
Foreign References:
| WO2014185311A1 |
Attorney, Agent or Firm:
Haruka International Patent Office