Title:
半導体用接着フィルムおよび半導体装置
Document Type and Number:
Japanese Patent JP6784446
Kind Code:
B2
Abstract:
There are provided an adhesive film for a semiconductor including: a conductive layer containing at least one metal selected from the group consisting of copper, nickel, cobalt, iron, stainless steel (SUS), and aluminum, and having a thickness of 0.05 μm or more; and an adhesive layer formed on at least one surface of the conductive layer and including a (meth)acrylate-based resin, a curing agent, and an epoxy resin, and a semiconductor device including the above-mentioned adhesive film.
Inventors:
Hee jun kim
Nu Li Na
Yong Kuk Kim
Kwan Ju Yi
Nu Li Na
Yong Kuk Kim
Kwan Ju Yi
Application Number:
JP2018567832A
Publication Date:
November 11, 2020
Filing Date:
November 15, 2017
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
H01L21/52; C09J7/28; C09J133/04; C09J163/00; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2012122058A | ||||
| JP2011253879A |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe