Title:
フラクシングアンダーフィル組成物
Document Type and Number:
Japanese Patent JP6785841
Kind Code:
B2
Abstract:
This invention relates to thermosetting resin compositions useful for fluxing underfill applications, particularly in the form of a preapplied film.
Inventors:
Jean, Hong
Application Number:
JP2018508746A
Publication Date:
November 18, 2020
Filing Date:
August 15, 2016
Export Citation:
Assignee:
Henkel AG & Co. KGaA
International Classes:
C08G59/42; C08G59/62; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP201491744A |
Attorney, Agent or Firm:
Katsuhiro Ito