Title:
有孔基板の製造方法及び有孔基板
Document Type and Number:
Japanese Patent JP6788830
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent occurrence of damages such as cracking caused by application of stress on the substrate, by steps of filling resin into the hollow part of a through-hole, hardening the resin, and polishing the unnecessary part of the resin by polishing.SOLUTION: A through-electrode substrate 10 has a first surface 13 and a second surface 14. The method according to the present invention includes the steps of: preparing a substrate 12 with a through-hole 20 penetrating the first surface to the second surface; positioning a resin material so that the resin material will lie across the inside and the outside of the through-hole at least on the first surface side and filling the resin material into the through-hole; irradiating the substrate with an electromagnetic wave or a charged particle line so that the part of the resin material which overlaps with the through-hole when the substrate is seen along the normal direction of the substrate will become hardened or will continue to be hard; removing the part of the resin material which is not hardened or is continued to be hard by the irradiation step; and thermally hardening thermal resin material.SELECTED DRAWING: Figure 2
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Inventors:
Naohiro Takahashi
Masashi Sakaki
Akari Ito
Daisuke Kitayama
Sasae Keidai
Masashi Sakaki
Akari Ito
Daisuke Kitayama
Sasae Keidai
Application Number:
JP2016194543A
Publication Date:
November 25, 2020
Filing Date:
September 30, 2016
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K3/42
Domestic Patent References:
| JP2015095590A | ||||
| JP2012175094A | ||||
| JP11163516A | ||||
| JP2002324974A | ||||
| JP2001111215A |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Yukihiro Hotta
Yoshiki Kanagawa
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Yukihiro Hotta
Yoshiki Kanagawa