Title:
熱抵抗が向上した電子チップデバイス、および関連する製造プロセス
Document Type and Number:
Japanese Patent JP6789968
Kind Code:
B2
Abstract:
An electronic chip device with improved thermal resistance comprises at least one electrical connection pad with an electrical interconnection link, at least one thermal pad arranged on a face of the chip, at least one heat exchange element, and at least one thermal link between a thermal pad and a heat exchange element.
Inventors:
Bar, Christian
Application Number:
JP2017549680A
Publication Date:
November 25, 2020
Filing Date:
March 22, 2016
Export Citation:
Assignee:
Threed Plus
International Classes:
H01L23/29; H01L23/12
Domestic Patent References:
| JP2004200316A | ||||
| JP11251483A | ||||
| JP2006222235A |
Foreign References:
| US20090267222 |
Attorney, Agent or Firm:
Kawaguchi International Patent Office