Title:
超音波探触子、超音波診断装置
Document Type and Number:
Japanese Patent JP6795986
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an ultrasound probe of which design change is easy according to the size and shape of the sensing area of various types of sensors having high sensitivity, and also to provide an ultrasound diagnostic apparatus equipped with such an ultrasound probe.SOLUTION: The ultrasound probe comprises: a plurality of sensor chips having sensor cells; and a substrate 3 on which are mounted the plurality of sensor chips with a predetermined spacing arranged therebetween. The ultrasound probe further includes film wiring 6 formed by covering an end portion of a first semiconductor chip 2a, an end portion of a second semiconductor chip 2b, a bottom portion of the spacing, a pad 7a of the first semiconductor chip, and a pad 7b of the second semiconductor chip, where the plurality of semiconductor chips which are adjacent are taken as the first semiconductor chip and the second semiconductor chip.SELECTED DRAWING: Figure 4
Inventors:
Tamotsu Yoshimura
Akifumi Sako
Naoaki Yamashita
Tatsuya Nagata
Akifumi Sako
Naoaki Yamashita
Tatsuya Nagata
Application Number:
JP2017005633A
Publication Date:
December 02, 2020
Filing Date:
January 17, 2017
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
A61B8/14
Domestic Patent References:
| JP2008235768A | ||||
| JP2002326384A | ||||
| JP2006122188A | ||||
| JP2016123063A | ||||
| JP7245385A |
Attorney, Agent or Firm:
Isono International Patent and Trademark Office