Title:
半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6797002
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which eliminates a need to arrange an insulation sheet in a metal mold in advance and thus can improve heat radiation performance and insulation quality, and to provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device 300 includes: a semiconductor element 1; a lead frame 2; a mold resin 7; a heat sink 9; and an insulation sheet 10. The lead frame 2 has: a mounting surface 2a on which the semiconductor element 1 is mounted; and a heat radiation surface 2b. The mold resin 7 seals the semiconductor element 1 and seals the lead frame 2 so as to expose the heat radiation surface 2b. The heat sink 9 faces the heat radiation surface 2b of the lead frame 2 exposed from the mold resin 7. The insulation sheet 10 is disposed between the heat radiation surface 2b of the lead frame 2 and the heat sink 9. At least a part of an outer peripheral end of the insulation sheet 10 is disposed forming a gap with the mold resin 7.SELECTED DRAWING: Figure 5
Inventors:
Yuki Okabe
Takanobu Kajiwara
Muneaki Hikita
Mitsunori Fujita
Tetsuo Emi
Tomohiro Inoue
Katsuhiko Omae
Takanobu Kajiwara
Muneaki Hikita
Mitsunori Fujita
Tetsuo Emi
Tomohiro Inoue
Katsuhiko Omae
Application Number:
JP2016225045A
Publication Date:
December 09, 2020
Filing Date:
November 18, 2016
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
| JP2189959A | ||||
| JP2002110867A | ||||
| JP2014203919A | ||||
| JP2006196576A | ||||
| JP2008166642A |
Attorney, Agent or Firm:
Fukami patent office