Title:
半導体モジュールおよび半導体モジュールの製造方法
Document Type and Number:
Japanese Patent JP6797760
Kind Code:
B2
Abstract:
This semiconductor module is achieved by having: a first cooling member; a semiconductor element that is provided above the first cooling member by having a first bonding layer therebetween; a pressing member that is provided above the semiconductor element by having a second bonding layer therebetween; and a first sealing material, which is provided above the first cooling member, and which seals a region positioned in the side surface direction of the semiconductor element and the pressing member. The pressing member comprises: a first block member; a second block member that is provided above the first block member; and a spring member and a second sealing material, which are provided in a region between the first block member and the second block member.
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Inventors:
Tomohisa Suzuki
Yusuke Yasuda
Yusuke Yasuda
Application Number:
JP2017135137A
Publication Date:
December 09, 2020
Filing Date:
July 11, 2017
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L23/29; H01L25/07; H01L25/18
Domestic Patent References:
| JP2015122429A | ||||
| JP10050904A | ||||
| JP2014192518A | ||||
| JP2003124406A |
Foreign References:
| WO2017037837A1 | ||||
| WO2015104954A1 |
Attorney, Agent or Firm:
Tsutsui International Patent Office
Yuji Toda
Yuji Toda