Title:
半導体発光装置、および、その製造方法
Document Type and Number:
Japanese Patent JP6800702
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To achieve high luminous efficiency and suppression of color unevenness in a luminous surface.SOLUTION: The semiconductor light-emitting device includes: a light-emitting element 10; a wavelength conversion layer 12 for converting the light emitted from the light-emitting element into the light with a predetermined wavelength; a light reflection member 13 covering at least a side face of the wavelength conversion layer; and a thin film 14 provided on an outermost surface from which the light subjected to wavelength conversion in the wavelength conversion layer emits, which has a property of rejecting the uncured light reflection member and whose surface is coarse.SELECTED DRAWING: Figure 1
Inventors:
Kaori Tachibana
Application Number:
JP2016218246A
Publication Date:
December 16, 2020
Filing Date:
November 08, 2016
Export Citation:
Assignee:
Stanley Electric Co., Ltd.
International Classes:
H01L33/50; H01L33/58
Domestic Patent References:
| JP2012079840A | ||||
| JP2012503876A | ||||
| JP2010219324A | ||||
| JP2014067876A | ||||
| JP2008041844A | ||||
| JP2013105877A | ||||
| JP2012129237A | ||||
| JP2008288409A |
Foreign References:
| WO2015019532A1 | ||||
| US20120205695 |
Attorney, Agent or Firm:
Patent Business Corporation Sannozaka Patent Office