Title:
電源装置
Document Type and Number:
Japanese Patent JP6805478
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a power supply device in which efficiency of cooling by cooling means is improved.SOLUTION: A power supply device 1 comprises: a main circuit board 20; a main transformer 30 and a resonant inductor 40 which are winding components mounted on the main circuit board 20; switching elements 51-58 and rectifying elements 61-66 which are a plurality of semiconductor elements mounted on the main circuit board 20; a housing 10 in which the main circuit board 20 is accommodated; and a heat dissipation fin 13 as first cooling means including a coolant flow passage in which a coolant for cooling a base plate 11 that is a bottom face of the housing 10 is circulated. In a view in a direction of the coolant flow passage, the semiconductor elements are disposed with the winding components interposed therebetween.SELECTED DRAWING: Figure 4
Inventors:
Teru Ikezawa
Yutaka Mizukami
Yutaka Mizukami
Application Number:
JP2015176667A
Publication Date:
December 23, 2020
Filing Date:
September 08, 2015
Export Citation:
Assignee:
tdk Corporation
International Classes:
H02M3/28; H01L23/473; H05K7/20
Domestic Patent References:
| JP2014175589A | ||||
| JP1139612U |
Foreign References:
| WO2014147930A1 | ||||
| WO2014147963A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Takashi Mikami
Yoshiki Kuroki
Takashi Mikami