Title:
半導体チップの製造方法、キット
Document Type and Number:
Japanese Patent JP6818037
Kind Code:
B2
Abstract:
The present invention provides a manufacturing method of a semiconductor chip, in which the manufacturing yield is excellent, and a kit. According to the present invention, a manufacturing method of a semiconductor chip includes Process 1 of forming an insulating layer on a base material, Process 2 of forming a patterned resist film on the insulating layer, Process 3 of forming the insulating layer having an opening portion by etching the insulating layer with the patterned resist film as a mask, Process 4 of removing the patterned resist film, Process 5 of filling the opening portion of the insulating layer with metal, and Process 6 of performing chemical-mechanical polishing on the insulating layer filled with metal. In at least one process of Process 1 to Process 6, a chemical liquid which includes an organic solvent and metal impurities including at least one metal atom selected from the group consisting of a Fe atom, a Cr atom, a Ni atom, and a Pb atom, and in which the total content of the metal atom is 0.001 to 100 mass ppt is used.
Inventors:
Tetsuya Uemura
Application Number:
JP2018542914A
Publication Date:
January 20, 2021
Filing Date:
September 29, 2017
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
H01L21/768; G03F7/004; G03F7/20; G03F7/32; G03F7/38; H01L21/027; H01L21/304; H01L23/522
Domestic Patent References:
| JP2010219466A | ||||
| JP2008208048A | ||||
| JP2013046005A | ||||
| JP2012009513A | ||||
| JP2000150519A | ||||
| JP2007243120A | ||||
| JP2009182225A | ||||
| JP2001144003A | ||||
| JP2005074415A |
Foreign References:
| WO2015190174A1 |
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mitsuhashi
Fumio Mitsuhashi