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Title:
断熱構造物
Document Type and Number:
Japanese Patent JP6818167
Kind Code:
B2
Abstract:
A thermal insulation structure for a substrate for use subsea, and a method of providing a thermal insulating structure. The structure comprises: an inner layer and an outer layer. The inner layer is the reaction product of a first part and a second part, wherein the weight ratio of the first part to the second part is from about 15:1 to 1:1. The first part comprises any of alkenyldialkyl terminated polydialkylsiloxane, alkenyldialkyl terminated polydialkylalkenylmethylsiloxane or mixtures thereof, which will individually or collectively have a viscosity of from 250 to 10000 mPa·s at 25° C., and a hydrosilylation catalyst. The second part comprises a mixture of organohydrogensiloxane having two Si—H bonds per molecule and organohydrogensiloxane having at least three Si—H bonds per molecule. The outer layer is the reaction product of a first part and a second part, wherein the weight ratio of the first part to the second part is from about 15:1 to 1:1. The first part comprises any of alkenyldialkyl terminated polydialkylsiloxane, alkenyldialkyl terminated polydialkylalkenylmethylsiloxane or mixtures thereof, which will individually or collectively have a viscosity of from 250 to 10000 mPa·s at 25° C., and a hydrosilylation catalyst. The second part comprises organohydrogensiloxane having at least two Si—H bonds per molecule and alkenylated MQ silicone resin, wherein said M group comprises at least two Si-alkenyl bonds per molecule.

Inventors:
Shepherd, Simon Harry
Laura Louise, Jordan
Swanton, Bryan
Bayer, Patrick
Bansek, romance
Application Number:
JP2019571544A
Publication Date:
January 20, 2021
Filing Date:
June 19, 2018
Export Citation:
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Assignee:
Advanced Insulation Limited
International Classes:
F16L59/02; B32B27/00; C08K7/18; C08L83/04
Domestic Patent References:
JP2005161132A
JP2016518969A
JP5156167A
Foreign References:
WO2013178992A1
WO2016156881A1
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki