Title:
半導体デバイスの位置決め加圧機構
Document Type and Number:
Japanese Patent JP6818527
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To acquire positioning and entire surface pressurization without any interference between mechanism components, and without any stranding of a semiconductor device onto peripheral components in a positioning pressurization mechanism of a semiconductor device.SOLUTION: A positioning pressurization mechanism of a semiconductor device comprises a cooling plate 12 with a stage 11 including a mounting part of a semiconductor device 1 fixed thereon, and a positioning mechanism 110 that is disposed opposite to the semiconductor device mounting part of the stage 11, and positions the semiconductor device on the stage. The positioning mechanism 110 includes a positioning guide 25 in which a semiconductor device side mounted to the stage is in a tapered shape 25a, a probe 24 fixed to the positioning guide 25 and pressure-contacted to the semiconductor device 1, and a floating mechanism 100 for horizontally and movably holding the probe 24.SELECTED DRAWING: Figure 1
Inventors:
Shoichi Ichioka
Yukihiro Toku
Yukihiro Toku
Application Number:
JP2016232062A
Publication Date:
January 20, 2021
Filing Date:
November 30, 2016
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
G01R31/26
Domestic Patent References:
| JP2013137286A | ||||
| JP2005134373A | ||||
| JP1126124A | ||||
| JP201611862A |
Foreign References:
| WO2009118855A1 | ||||
| US20020088113 |
Attorney, Agent or Firm:
Patent Business Corporation Parumo Patent Office
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa