Title:
電子部品用液状樹脂組成物及び電子部品装置
Document Type and Number:
Japanese Patent JP6825643
Kind Code:
B2
Abstract:
To provide a liquid resin composition for an electronic component excellent in flowability through a narrow gap, and having suppressed void, bleeding and creeping; and to provide an electronic component apparatus sealed thereby.SOLUTION: A liquid resin composition for an electronic component contains (A) a resin, (B) an inorganic filler (C) an inorganic filler having a peak of 100 nm or less, preferably, 50 nm or less in a laser diffraction method, in which a content of the inorganic filler obtained by adding (B) the inorganic filler to (C) the inorganic filler is 67-77 mass% to the whole liquid resin composition for the electronic component.SELECTED DRAWING: None
Inventors:
Toshito Takahashi
Seiichi Akagi
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Seiichi Akagi
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Application Number:
JP2019090899A
Publication Date:
February 03, 2021
Filing Date:
May 13, 2019
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
C08L101/00; C08K3/00; C08K3/013; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2012149111A | ||||
| JP2009057575A | ||||
| JP2007182493A | ||||
| JP10130470A |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office