Title:
電子部品実装用パッケージおよび電子装置
Document Type and Number:
Japanese Patent JP6826175
Kind Code:
B2
Abstract:
To provide a package for mounting an electronic component, which is effective for improving the bonding strength between an external electrode or the like and a base, and an electronic device provided with the package for mounting an electronic component.SOLUTION: An electronic component mounting package 2A that is provided in an electronic device 1A, is an electronic component but is mounted, and includes a base 21A having a second surface including a board connection region connected to an external circuit board, a board connection protrusion 232A which is a second protrusion protruding from the board connection region on the second surface, and an external electrode pad 231A which is a second conductor layer provided so as to cover the second protrusion.SELECTED DRAWING: Figure 6
Inventors:
Kazuya Hashimoto
Kenichi Nagae
Yasuo Fukuda
Mitsuharu Sakai
Yubasaki Atsushi
Okuno Hayato
Kenichi Nagae
Yasuo Fukuda
Mitsuharu Sakai
Yubasaki Atsushi
Okuno Hayato
Application Number:
JP2019199961A
Publication Date:
February 03, 2021
Filing Date:
November 01, 2019
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12; H01L23/13; H03H9/02
Domestic Patent References:
| JP3227559A | ||||
| JP2010166018A | ||||
| JP2004022841A | ||||
| JP2006196860A | ||||
| JP2014123861A |