Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP6828510
Kind Code:
B2
Abstract:
The subject of the present invention is to provide a resin composition which may obtain an insulation layer capable of reducing dielectric constant and improving adhesion with conductor layer. The solution of the present invention provides a resin composition, which contains component (A) epoxy resin, component (B) active ester compound, component (C) inorganic filler, and component (D) fluoro-filler. While nonvolatile components of the resin composition is set as 100 weight %, a content of component (D) is 10 to 40 weight %. a total content of component (C) and component (D) is set as 100 weight %, the content of component (D) is 20 to 70 weight %.
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Inventors:
Nagashima Masaki
Watanabe Masatoshi
Watanabe Masatoshi
Application Number:
JP2017035468A
Publication Date:
February 10, 2021
Filing Date:
February 27, 2017
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; C08G59/42; C08K5/00; C08L27/18; C09J4/02; C09J7/20; C09J11/04; C09J11/06; C09J11/08; C09J163/00; H01L23/14; H05K1/03
Domestic Patent References:
| JP2013079326A | ||||
| JP2016166347A | ||||
| JP2016117803A |
Attorney, Agent or Firm:
Sakai International Patent Office