Title:
センサ取付構造及びエネルギ吸収構造
Document Type and Number:
Japanese Patent JP6830502
Kind Code:
B2
Abstract:
A sensor attachment structure includes an energy absorption member, a sensor attachment portion provided to the energy absorption member and configured to attach a sensor case that houses a pressure sensor, and a cover that defines a space to house the sensor case between the cover and the sensor attachment portion. The sensor case is attached to the sensor attachment portion by locking. At least one of the sensor case, the sensor attachment portion, and the cover includes a fall preventing structure that prevents the sensor case from falling off an opening formed by the sensor attachment portion and the cover.
Inventors:
Teruaki Aizawa
Tatsuya Ishizaki
Hiroyuki Midorikawa
Maki Umezawa
Keita Kataoka
Tatsuya Ishizaki
Hiroyuki Midorikawa
Maki Umezawa
Keita Kataoka
Application Number:
JP2019026011A
Publication Date:
February 17, 2021
Filing Date:
February 15, 2019
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
B60R19/48; B60R19/14
Domestic Patent References:
| JP2018054583A |
Foreign References:
| WO2019225578A1 |
Attorney, Agent or Firm:
Isono International Patent and Trademark Office