Title:
部品実装装置および部品データ作成方法
Document Type and Number:
Japanese Patent JP6831460
Kind Code:
B2
Abstract:
This component mounting device (100) comprises: a mounting head (4) for mounting a component (C) onto a substrate (S); an imaging unit (8) that can image a component; and a control unit (11) that creates component data which is for recognizing the component, the data created on the basis of the image of the component that was imaged by the imaging unit. The control unit is configured so as to perform control in which component data is created by causing the imaging unit to image the component multiple times under different imaging conditions.
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Inventors:
Takatoshi Mizushima
Application Number:
JP2019526402A
Publication Date:
February 17, 2021
Filing Date:
June 26, 2017
Export Citation:
Assignee:
YAMAHA HATSUDOKI KABUSHIKI KAISHA
International Classes:
H05K13/08
Domestic Patent References:
| JP2005123352A | ||||
| JP2002110745A | ||||
| JP2005107716A | ||||
| JP2001135999A | ||||
| JP7038294A | ||||
| JP5296725A | ||||
| JP2005005619A | ||||
| JP2009164231A | ||||
| JP2011211088A | ||||
| JP2013191775A |
Foreign References:
| WO2015181974A1 | ||||
| WO2014049873A1 |
Attorney, Agent or Firm:
Hirokazu Miyazono