Title:
実装構造体、超音波デバイス、超音波探触子、超音波装置、及び電子機器
Document Type and Number:
Japanese Patent JP6834289
Kind Code:
B2
Abstract:
A mounting structure includes a first substrate on which an elastic core section is provided, a conductive film that is provided over the first substrate from an upper part of the core section, and a second substrate on which a wiring portion connected to the conductive film on the core section is provided, in which the conductive film has a notch that partially exposes an end part of a surface of the core section which is in contact with the first substrate.
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Inventors:
Hironori Suzuki
Hiroshi Matsuda
Koji Ohashi
Hiroshi Matsuda
Koji Ohashi
Application Number:
JP2016184362A
Publication Date:
February 24, 2021
Filing Date:
September 21, 2016
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L21/60; A61B8/14; H01L23/12; H03H9/09; H04R1/06; H04R17/00; H05K1/14
Domestic Patent References:
| JP2007012813A | ||||
| JP2007048801A | ||||
| JP2007019184A | ||||
| JP2016049193A | ||||
| JP2007180166A | ||||
| JP2008103584A |
Attorney, Agent or Firm:
Intellectual Property Office