Title:
フェノール性水酸基含有ポリアミド樹脂、およびその組成物
Document Type and Number:
Japanese Patent JP6834444
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a phenolic hydroxyl group-containing polyamide resin which is excellent in solvent solubility and has high gas barrier properties under high humidity, and a resin composition containing the same.SOLUTION: The phenolic hydroxyl group-containing polyamide resin contains 10 mol% or more of a dicarboxylic acid unit having a phenolic hydroxyl group and 20 mol% or more of an aromatic diamine unit and satisfies the following (1) and (2): (1) the phenolic hydroxyl group content is 500-6,000 eq/t; and (2) when a thin film having a film thickness of 1 μm is formed of the phenolic hydroxyl group-containing polyamide resin, the thin film has an oxygen permeability of 1,000 ml/mday MPa or less at a temperature of 40°C and a humidity of 85% RH.SELECTED DRAWING: None
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Inventors:
Naoko Oda
Hideki Tanaka
Hideki Tanaka
Application Number:
JP2016242227A
Publication Date:
February 24, 2021
Filing Date:
December 14, 2016
Export Citation:
Assignee:
Toyobo Co., Ltd.
International Classes:
B32B27/34; C08L77/06; B65D65/40; B65D81/24; C08G69/26; C08K7/00
Domestic Patent References:
| JP2004831A | ||||
| JP2007246668A | ||||
| JP2014122326A | ||||
| JP2004217698A |
Foreign References:
| WO2010058734A1 | ||||
| US20070015896 |