Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ダイ、ダイパック、単結晶育成装置、及び単結晶育成方法
Document Type and Number:
Japanese Patent JP6841490
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a die having an opening angle easily and optimally settable to the thickness of a single crystal to be grown; a die pack; a single crystal growth apparatus; and a single crystal growth method.SOLUTION: The tip of a die having a slit and used for an EFG method is formed at an opening angle y1 (where, y1<180°). The opening angle y1 is formed at an angle associated with a linear function formula y=ax+b (where, y<180°, x>0 mm, a>0, b>0°) of the thickness x mm of the die; b is 47.0° or more and 47.39°or less; the thickness x is 3.3 mm or more and 6.5 mm or less; and a is 7.75 or more and 7.80 or less. The opening angle y1 is within ±5% of the linear function formula. The die pack includes such two or more dice and is constituted so that the longitudinal direction of each slit is arranged in parallel; the single crystal growth apparatus includes the die or the die pack; and the single crystal growth method is formed using the die, the die pack or the single crystal growth apparatus.SELECTED DRAWING: Figure 3

Inventors:
Several Higuchi
Toshiro Kotaki
Hironori Saito
Masayuki Takahashi
Second son Sato
Yoichi Yaguchi
Application Number:
JP2016204031A
Publication Date:
March 10, 2021
Filing Date:
October 18, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Adamant Namiki Precision Jewel Co., Ltd.
International Classes:
C30B15/24; C30B29/20
Domestic Patent References:
JP2016060692A