Title:
立体造形物を造形する装置、プログラム、立体造形物を造形する方法、立体造形物の造形データを作成する装置
Document Type and Number:
Japanese Patent JP6848443
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve the problem in which evenness of a molded surface is lowered at a region where there is no molded layer on a (n-1)th layer which is an under layer thereof when molding an n-th layer of molded layers.SOLUTION: The apparatus includes: a head 52 for applying a molding liquid 10 for bonding a powder 20 to the powder 20 laid in a layer to mold a molded layer 30 which is a layering molded article; means for controlling to mold a three-dimensional molded article obtained by laminating molded layers 30 by repeating actions of molding the molded layers 30 by applying the molding liquid 10, where the molding liquid 10 is applied to a new molding region 30B having no molded layer 30 on a (n-1)th layer by dividing into 4 times when molding an n-th layer of the molded layers 30, and the molding liquid 10 is applied to an existing molding region 30B having a molded layer 30 on a (n-1)th layer at one time.SELECTED DRAWING: Figure 12
Inventors:
Takafumi Sasaki
Shinichiro Sato
Shinichiro Sato
Application Number:
JP2017001415A
Publication Date:
March 24, 2021
Filing Date:
January 06, 2017
Export Citation:
Assignee:
株式会社リコー
International Classes:
B22F3/16; B22F3/02; B28B1/30; B33Y10/00; B33Y30/00; B33Y50/00
Domestic Patent References:
| JP2005120475A | ||||
| JP2012030389A | ||||
| JP2016028878A | ||||
| JP2015131399A | ||||
| JP2016500594A |
Foreign References:
| WO2015108550A1 |
Attorney, Agent or Firm:
Tomiho Inamoto