Title:
コンタクトレスインターフェースを形成する少なくとも１つのトランジションを含むパッケージ構造
Document Type and Number:
Japanese Patent JP6852153
Kind Code:
B2
Abstract:
A packaging structure (100) having a split-block assembly with a first and a second conducting block section (10A,20A) and at least one transition between a first planar transmission line (2A) and a second transmission line (11A), and one or more input/output ports. The first transmission line (2A) is arranged on a substrate disposed on the first conducting block section (10A) and has a coupling section (3A), a cavity (4A) with a cavity opening in an upper surface of the first conducting block section (10A), and the second transmission line (11A) being in line with the first transmission line (2A) and located on an opposite side of the opening of the cavity (4A).
Inventors:
Zaman, Ashraf Uz
Yang, Jean
Nadi, Uttam
Yang, Jean
Nadi, Uttam
Application Number:
JP2019518089A
Publication Date:
March 31, 2021
Filing Date:
October 05, 2016
Export Citation:
Assignee:
Gap Waves Arb
International Classes:
H01P5/107
Domestic Patent References:
| JP2003008313A | ||||
| JP2011234089A | ||||
| JP9026457A |
Foreign References:
| WO2002071533A1 | ||||
| WO2010050122A1 |
Attorney, Agent or Firm:
Patent business corporation Oshima patent office