Title:
測定装置
Document Type and Number:
Japanese Patent JP6852171
Kind Code:
B2
Abstract:
Provided is a measurement device that is equipped with measurement electrodes that can contact component electrodes even when the component electrodes have a round shape, and that has a different structure from the structure of a measurement device disclosed in Patent Document 1. In this measurement device, a pair of measurement electrodes each include a plurality of wires. When a component is pressed onto the pair of measurement electrodes, the plurality of wires are made to elastically deform. Therefore, each component electrode can be made to stably contact at least one wire out of the plurality of wires even when the component electrodes have a round shape. Furthermore, the structure of the measurement device is different from the structure of the measurement device disclosed in Patent Document 1.
Inventors:
Toshiyuki Sawada
Application Number:
JP2019542847A
Publication Date:
March 31, 2021
Filing Date:
September 19, 2017
Export Citation:
Assignee:
Fuji corporation
International Classes:
G01R31/28; G01R1/067; G01R31/26; H05K13/08
Domestic Patent References:
JP2009283952A | ||||
JP2011203087A | ||||
JP2009229249A | ||||
JP2006194831A | ||||
JP2014169975A | ||||
JP2008157904A | ||||
JP2011169729A | ||||
JP6048998B1 | ||||
JP9199897A |
Attorney, Agent or Firm:
Chubu International Patent Office