Title:
板状はんだの製造装置およびその製造方法
Document Type and Number:
Japanese Patent JP6852784
Kind Code:
B2
Abstract:
A device for manufacturing a plate solder according to the present invention includes a reel on which a thread solder is wound; a cutter that cuts the thread solder, provided between the reel and an end part of the thread solder extending from the reel; an aggregating part that aggregates a plurality of cut thread solders such that the plurality of thread solders are in contact with one another; and a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder.
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Inventors:
Uozumi Moriji
Kazuhiko Sakuya
Kazuhiko Sakuya
Application Number:
JP2019505633A
Publication Date:
March 31, 2021
Filing Date:
March 16, 2017
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B23K35/40
Domestic Patent References:
| JP6132645A | ||||
| JP63119997A | ||||
| JP8118074A | ||||
| JP6038228B2 | ||||
| JP2002210552A |
Foreign References:
| US6386426 |
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Yoshimi Kuno
Hideki Takahashi
Yoshimi Kuno