Title:
基板とコネクタとの接続構造および基板
Document Type and Number:
Japanese Patent JP6853655
Kind Code:
B2
Abstract:
A structure that includes a board and a connector secured to an end portion of the board. The board has a first dielectric layer, a signal pattern that is provided on the top face of the first dielectric layer, a first ground layer that is provided under the first dielectric layer and forms part of a signal transmission circuit in conjunction with the signal pattern, and a plating film formed on an end face of the end portion of the board in an area located directly under the signal pattern and includes an end face of the first ground layer. The connector has a center conductor, an outer conductor, and securing portions that secure the connector to an end portion of the board. When the connector is secured, the center conductor comes in contact with the signal pattern and the plating film comes in contact with the outer conductor.
Inventors:
Teppei Matsumoto
Application Number:
JP2016221169A
Publication Date:
March 31, 2021
Filing Date:
November 14, 2016
Export Citation:
Assignee:
Hirose Electric Co., Ltd.
International Classes:
H01R12/51; H01R24/38; H05K1/02; H05K1/11; H05K3/46
Domestic Patent References:
| JP2014096250A | ||||
| JP10327004A | ||||
| JP2007141607A | ||||
| JP2003208949A | ||||
| JP2011065886A |
Attorney, Agent or Firm:
Shuichi Kitamura
Takeo Nakajima
Takeo Nakajima