Title:
基板接合体および伝送線路装置
Document Type and Number:
Japanese Patent JP6856141
Kind Code:
B2
Abstract:
A transmission line device includes a first multilayer substrate with a transmission line including laminated insulating base materials and a conductor pattern on the insulating base materials, and a second multilayer substrate defining a connected member to which the transmission line of the first multilayer substrate is connected. The conductor pattern includes a signal conductor pattern and a signal electrode pad electrically connected to the signal conductor pattern. The first multilayer substrate includes a resist film provided on a surface of a laminate of the insulating base materials, and the resist film includes an opening that is separated from an outer edge of the signal electrode pad in a surface direction of the laminate of the insulating base material and exposes the signal electrode pad.
Inventors:
Water Kuniaki
Application Number:
JP2019563015A
Publication Date:
April 07, 2021
Filing Date:
December 17, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K1/14; H05K1/02; H05K3/34; H05K3/46
Domestic Patent References:
| JP201482455A | ||||
| JP8236894A |
Foreign References:
| WO2016088592A1 | ||||
| US7405477 | ||||
| WO2014069061A1 |
Attorney, Agent or Firm:
Kaede International Patent Office