Title:
レーザ加工方法及びレーザ加工装置
Document Type and Number:
Japanese Patent JP6860429
Kind Code:
B2
Abstract:
Provided are a laser processing method and a laser processing apparatus to easily and quickly determine whether the groove shape of a laser processing groove is good or bad. A pulse laser beam (LB) whose energy intensity distribution is a Gaussian distribution is irradiated to a wafer (W) through a mask (34a) to form a laser processing groove while light emission generated by irradiating the wafer(W) with the pulse laser beam (LB) is picked up by an image pickup means (38) to form a pick-up image. A groove shape determination section (63) determines whether the groove shape of the laser processing groove is good or bad based on the shape of the light emission on the picked-up image. A mask position adjustment section (64) operates a mask moving means (35) in accordance with the determination result of the groove shape to adjust the position of the mask (34) with respect to the pulse laser beam (LB).
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Inventors:
Kentaro Odanaka
Application Number:
JP2017112709A
Publication Date:
April 14, 2021
Filing Date:
June 07, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B23K26/364; B23K26/00; B23K26/066; H01L21/301
Domestic Patent References:
| JP2014072375A | ||||
| JP11320149A | ||||
| JP2003019581A | ||||
| JP2014016304A | ||||
| JP2010120065A | ||||
| JP2009233753A | ||||
| JP2006319198A | ||||
| JP2013197108A | ||||
| JP10146683A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office