Title:
基板位置認識装置、位置認識加工装置および基板製造方法
Document Type and Number:
Japanese Patent JP6860440
Kind Code:
B2
Abstract:
There are provided a position recognition apparatus for printed circuit board (PCB), a position recognition and processing apparatus, and a printed circuit board manufacturing method. A position recognition apparatus for PCB configured to recognize a mounting position of an LED package on a PCB, the LED package being including a phosphor emitting fluorescence in operation, includes: an illuminating means configured to irradiate the PCB with light containing a blue component; an observation filter configured to selectively pass at least blue light of reflected light from the PCB and fluorescence from the phosphor and cut light in a wavelength region longer than a wavelength of the blue light; an imaging means configured to capture an image of the light passed by the observation filter; and an image processing means configured to calculate a position of the phosphor on the PCB, based on image data captured by the imaging means.
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Inventors:
Kenichi Mishima
Application Number:
JP2017140849A
Publication Date:
April 14, 2021
Filing Date:
July 20, 2017
Export Citation:
Assignee:
Nippon Mektron Co., Ltd.
International Classes:
H05K13/04; H05K13/08
Domestic Patent References:
| JP2014002150A | ||||
| JP2014135482A | ||||
| JP5903563B2 | ||||
| JP2006054484A |
Foreign References:
| WO2015166543A1 |
Attorney, Agent or Firm:
Iat International Patent Business Corporation