Title:
粘着テープ貼付け装置
Document Type and Number:
Japanese Patent JP6861009
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive tape applying device capable of properly applying an adhesive tape to an object by absorbing the slackness of the adhesive tape even where there is slack in the adhesive tape whose release paper is separated.SOLUTION: An adhesive tape applying device comprises: a first guide 140 that guides to a first location a release-paper laminated adhesive tape whose release paper is releasably provided on an adhesive tape; a second guide 212 that the release-paper laminated adhesive tape passing via the first location is guided along a first direction toward a second location different from the first location, displaces a direction of at least an adhesive tape AT of the release-paper laminated adhesive tape from the first direction toward a second direction different from the first direction, releases a release paper RP from the release-paper laminated adhesive tape in the course of a displacement from the first direction to the second direction, and guides the release paper thus released along the first direction; and a traction part 150 for towing the adhesive tape, from which the release paper is released and guided along the second direction.SELECTED DRAWING: Figure 9
More Like This:
| JPS62177085 | ADHESIVE TAPE FOR CONNECTING ELECTRONIC PART |
Inventors:
Shuji Ichimura
Tomoyuki Inagaki
Tomoyuki Inagaki
Application Number:
JP2016193220A
Publication Date:
April 21, 2021
Filing Date:
September 30, 2016
Export Citation:
Assignee:
Nichiban Co., Ltd.
International Classes:
B65H35/07; B65H41/00; C09J7/00
Domestic Patent References:
| JP9202514A | ||||
| JP2008001456A |
Attorney, Agent or Firm:
Ito On
Akira Kaneki
Takao Inoue
Akira Kaneki
Takao Inoue