Title:
半導体装置
Document Type and Number:
Japanese Patent JP6866716
Kind Code:
B2
Abstract:
After a contact component is disposed in a concave joint space, when a solder solidifies, the solder thickness of the solder in the joint space is kept. Thus, a contact area between the contact component and the solder is kept, and the solder thickness of the solder that joins the contact component and a conductive pattern is kept. In addition, since an appropriate amount of the solder is kept in the joint space, an extra amount of solder does not need to be applied in advance. As a result, there is prevented creeping up of the solder into a hollow hole of the contact component, caused by the heat applied when the contact component is joined to the conductive pattern.
Inventors:
Takeshi Kai
Rikihiro Maruyama
Hiroyuki Miyazaki
Rikihiro Maruyama
Hiroyuki Miyazaki
Application Number:
JP2017056844A
Publication Date:
April 28, 2021
Filing Date:
March 23, 2017
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L23/12; H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| JP2012004226A | ||||
| JP2014187179A | ||||
| JP2013084764A | ||||
| JP2010140986A | ||||
| JP2016006806A |
Attorney, Agent or Firm:
Fuso International Patent Office