Title:
プリント配線板
Document Type and Number:
Japanese Patent JP6869855
Kind Code:
B2
Abstract:
To provide a printed wiring board capable of suppressing separation while preventing compression of the disposition effective area for other copper foil patterns.SOLUTION: The printed wiring board has through holes around which a land is formed. The land includes an auxiliary land which has an outer periphery for resisting a force towards the through hole.SELECTED DRAWING: Figure 4
Inventors:
Hiroyoshi Miyazaki
Yasushi Sasaki
Kiyotaka Tomiyama
Yasushi Sasaki
Kiyotaka Tomiyama
Application Number:
JP2017171242A
Publication Date:
May 12, 2021
Filing Date:
September 06, 2017
Export Citation:
Assignee:
Hitachi Industrial Equipment Systems Co., Ltd.
International Classes:
H05K3/34; H01L23/12
Domestic Patent References:
| JP2003218534A |
Attorney, Agent or Firm:
Aoritsu patent business corporation