Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
3次元実装関連装置
Document Type and Number:
Japanese Patent JP6870067
Kind Code:
B2
Abstract:
This three-dimensional mounting-related device applies a viscous liquid to a three-dimensional object to be processed having a plurality of mounting surfaces, and/or arranges a member. The three-dimensional mounting-related device is provided with: an XY robot provided with a processing head which applies the viscous liquid to the three-dimensional object to be processed, and/or arranges a member, and a movement unit for moving the processing head in a prescribed planar direction; an articulated robot which holds, in a changeable manner, the orientation of the object to be processed relative to the processing head, and which moves the object to be processed between an introduction position, a processing position, and a discharge position; and a control unit for controlling the XY robot and the articulated robot.

Inventors:
Go Hamane
Shinji Ichino
Application Number:
JP2019504199A
Publication Date:
May 12, 2021
Filing Date:
March 08, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Fuji corporation
International Classes:
H05K13/04; H05K3/34; H05K13/08
Domestic Patent References:
JP2017019059A
JP10209688A
JP2018067658A
JP2016127187A
JP2003197713A
Foreign References:
WO2012117790A1
WO2008087702A1
Attorney, Agent or Firm:
Aitec International Patent Office