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Title:
熱処理装置および熱処理方法
Document Type and Number:
Japanese Patent JP6872914
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat treatment device and heat treatment method, capable of quickly recovering a temperature of a hot plate when a heat disturbance occurs.SOLUTION: A hot plate for heating a substrate mounted on the hot plate comprises a main heater and an auxiliary heater. When the hot plate's temperature is in a stable state, output of the auxiliary heater is zero and the hot plate is heated by the main heater only. When a heat disturbance is generated on the hot plate by a new normal temperature substrate being mounted or the like, a heater operation output amount required for recovering the hot plate's temperature to a preset temperature is acquired using calculation. When the acquired heater operation output amount exceeds maximum output of the main heater, a heater control unit controls output of the auxiliary heater so that a shortage of output of the main heater with respect to the operation output amount is compensated by the auxiliary heater.SELECTED DRAWING: Figure 4

Inventors:
Toru Kadoma
Fukumoto Yasuhiro
Koji Nishi
Shigehiro Goto
Jun Tanaka
Kenichiro Castle
Application Number:
JP2017014409A
Publication Date:
May 19, 2021
Filing Date:
January 30, 2017
Export Citation:
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Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/027; H05B3/00
Domestic Patent References:
JP2000286197A
JP2002083671A
JP2003059626A
JP10307495A
JP2012151247A
JP11204413A
Foreign References:
WO2016151651A1
US20130269614
KR1020120083843A
KR1020120039189A
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita